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Electrochemical-Etching

For which of following physical deposition technique is not suitable?

Deep trenches Flat surfaces Wafer of very reactive material Rough surfaces

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Similar Question

This Chapter Electrochemical-Etching consists of the following topics

In case of deep holes/grooves the choice of technique plays an important role.

For which of following physical deposition technique is not suitable?

In chemical vapour deposition, chemicals containing the desired film/layer are used.

For which of the following physical deposition technique is not suitable?

Electrochemical Etching

Manufacturing-Engineering-II